Dayue Precision Technology

Dayue Precision Technology

lexie@dayuechn.com

+86-13412420118

Dayue Precision Technology
HomeProductsInjection Mold ComponentsMold standard componentsДетали пресс-форм для упаковки полупроводников

Детали пресс-форм для упаковки полупроводников

  • $1
    ≥1
    Piece/Pieces
Payment Type:
L/C,T/T,D/P,D/A,Paypal
Incoterm:
FOB,CFR,EXW,FCA,DDP,DDU,Express Delivery
Min. Order:
1 Piece/Pieces
Transportation:
Ocean,Land,Air,Express
Port:
Yantian
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  • Product Description
Overview
Product Attributes

Model No.DAYUE0020

Supply Ability & Additional Information

TransportationOcean,Land,Air,Express

PortYantian

Payment TypeL/C,T/T,D/P,D/A,Paypal

IncotermFOB,CFR,EXW,FCA,DDP,DDU,Express Delivery

Packaging & Delivery
Selling Units:
Piece/Pieces

-Product Information
-DAYUE Precision Parts Manufacturing Factory, We have several factories in China. Specialized in processing all kinds of Precision Mold Parts, mechanical parts, carbide molds, tungsten carbide non-standard parts, tungsten steel machining, automation equipment components, FA automation parts Valve Components, medical device parts and other various precision parts manufacturing.

-Our advantage is heat-treated parts, we are good at secondary finishing by internal and external grinding, slow walking wire, mirror discharge, honing, PG optical grinder, gun drilling deep hole drilling and so on.

-Our diameters can generally reach ±0.001, white steel finish up to 0.4, tungsten steel finish up to 0.1.

semiconductor mold encapsulation for other parts of the product, such as electronic components, microchips, sensors, etc. This protects these parts from moisture, dust, corrosion and other adverse factors, which can improve their reliability and durability. We offer a wide range of mold encapsulation materials and technologies to meet the needs of our customers.

Our company specializes in the design and manufacture of semiconductor mold encapsulations that provide reliable protection for electronic components from external influences. We utilize advanced technology and high quality materials to ensure product durability and reliability.

Our semiconductor mold encapsulations are highly protected against moisture, dust, corrosion and other adverse factors. We offer a wide range of materials, including epoxies, silicones and polyurethanes, which can be customized to meet your requirements and operating conditions.

Our engineers have extensive experience in the design and manufacture of semiconductor mold encapsulations, and we are prepared to offer customized solutions for each customer. We can also offer testing and analysis services to ensure our products meet high quality standards.

When you contact us, you can be assured of receiving high quality semiconductor mold encapsulations that will provide reliable protection for your electronic components and improve their reliability and durability. Our company is proud of our reputation as a reliable supplier of semiconductor mold encapsulations, and we strive to meet all of our customers' needs

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Product Categories : Injection Mold Components > Mold standard components

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